
全自动激光解键合设备
应用领域:适用于半导体封装临时键合的拆解。示例机型:
DSI-S-DB660
应用领域Application:
适用于半导体封装临时键合的拆解。
Applied to break the temporary bond in wafer packaging.
主要特点Main Features:
● 全自动兼容8寸、12寸片生产,带条码自动扫描系统;
Automatic production, compatible with 8 & 12 inch wafer, with bar code auto-scanning system;
● 配合特殊剥离涂层,有效减少材料损伤,良品率高;
With special coating material, effectively reduce the damage, high yield;
● 采用先进的光斑整形技术,光斑均匀分布;
Advanced beam forming technique and uniformly distributed light spot;
● 拥有光斑质量监控与反馈系统,保证光斑的稳定性;
Beam quality monitor and feedback system ensure the quality and stability;
● 携带激光加工能量监控与自动补偿系统,保证能量的稳定性;
Laser power detector and negative feedback system, provide energy stability;
● Carrier自动分离与回收功能;
Carrier auto separation and recycle system;
● Warped Wafer Handling功能。
Warped Wafer Handling Function。
主要参数 Main Parameters:
可加工晶圆尺寸(Wafer Size) | 8inch、12 inch |
加工速度( Processing Speed) | 最大1000mm/s |
X 、Y轴精度(X,Y Axis Accuracy) | 直线度(Straightness):±1.0μm ; 重复定位精度(Repeating Accuracy):±1μm;定位精度(Positioning Accuracy):±1μm |
Z轴升降范围(Z Axis Range) | 0~30mm |
Z轴重复精度误差(Z Axis Repeating Accuracy Error) | ±1μm |
长×宽×高(L × W × H) | 2100mm×2050mm×1860mm |
实例效果 Sample Effect: