示例机型：

HDL-8500/8510

应用领域Application：

适用于硅、陶瓷、玻璃、砷化镓、磷化铟、各类引线框架/基板类封装体的切割等材料的切割，全系列兼容6-12寸晶圆。

Blade saw applied for silicon, ceramic, gallium arsenide, and various materials like lead-frame and substrate, compatible with 6-12 inch wafer.

主要特点Main Features ： 

● 外观尺寸追求小型化，占地面积小，切割行程大；

Miniaturized size and occupied area, but with huge working range;

● 配备NCS、BBD、漏液检测模块、远程控制模块,智能化、高效化适应客户需求；

Equipped with NCS (Non-Contact Setup) block, BBD (blade break detect) block and weeping detecting block, adapt to customer's requirements intelligently and efficiently;

● 大功率主轴，高速高精度电机，大幅提高生产效率；

High power spindle, high speed & high precision motor, highly increase the yield;

● 高效的自动对准,自动刀痕识别以及崩边检测功能；

Efficient auto-focus, auto cutting line recognition and chipping detection function;

● 多种切割模式任意选择,配有数据管理和日志管理系统,随时监控生产状况；

Switch to various cutting mode arbitrarily, with data management and log management system, easy to monitor the manufacture process at any time;

● 配备17英寸触屏显示器，呈现更多信息。

Equipped with 17 inch touch screen, getting more information during the working process.

主要参数 Main Parameters：

实例效果 Sample Effect：