示例机型：

DSI-S-TC9212

应用领域Application:

基于硅、碳化硅、GaN等常见半导体材料,开发出的高精度、高效率的针对透光性衬底晶圆的全自动激光内部改质切割设备。

Han's DSI Develop laser internal modification machine specified for semiconductor materials,like Silicon, Silicon Carbide, Gallium Nitride, which is of high precision and high efficiency。

主要特点Main Features:

● 全自动兼容4/6/8/12寸片生产；

Applied for 4,6,8 and 12 inch wafer;

● 采用高效的进口激光器,工艺效果稳定；

High quality laser device and stable process effect;

● 携带DRA自动跟随系统,切深随片厚实时调整,可兼容±10μm片厚误差；

Combined with DRA (Dynamic Range Adjustment) system, where the focal point can be dynamically adjusted according to the thickness variation of the material. Compatible with the tolerance of ±10um;

● CCD携带红外成像，具备正、背切功能；

IR Imaging CCD, capable for dicing from both sides;

● 针对小晶粒产品配套真空裂片系统,保证扩膜良率。

Vacuum splitting system specified to micro-chip production, ensure the effect of die-spread.

主要参数 Main Parameters:

实例效果 Sample Effect：